Lighting assembly and method for manufacturing a lighting assembly
US10551011B2 · kind B2 · utility
2Cited by
19References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 16, 2014 |
| Grant date | Feb 4, 2020 |
| Priority date | — |
| Expiry date | Jun 30, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49171
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a lighting assembly is disclosed, wherein a light emitting diode (LED) element (120) is arranged on a leadframe (110). The LED element (120) is configured to emit light when supplied with electrical power by means of the leadframe (110). At least a portion of the leadframe (110) is provided with an optically reflective and electrically insulating material (130) arranged to reflect light emitted from the LED element (120) and to electrically insulate at least a portion of the leadframe (110). A lighting assembly comprising the LED element (120) and the leadframe (110) is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.