Joint for brittle materials
US10551261B2 · kind B2 · utility
1Cited by
17References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 28, 2017 |
| Grant date | Feb 4, 2020 |
| Priority date | — |
| Expiry date | Dec 13, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/32225
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of joining a brittle material to a component is provided. The method includes depositing a metallization layer on a surface of the brittle material. A layer of joining material is applied between the brittle material and the component, such that the component and the brittle material define an interface area. The metallization layer and the joining material layer extends beyond the interface area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.