Thermal management hinge
US10551881B2 · kind B2 · utility
5Cited by
15References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 17, 2017 |
| Grant date | Feb 4, 2020 |
| Priority date | — |
| Expiry date | Mar 17, 2037 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2280/105
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The disclosed technology includes a thermal management hinge connecting at least two hinged components of a computing device. The thermal management hinge has at least two different thermal orientations for managing thermal conditions within each of the hinged components. For example, the thermal management hinge may have a thermally conductive orientation and the thermally insulating orientation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.