Bin packing in 3D printers
US10552095B1 · kind B1 · utility
1Cited by
4References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 15, 2018 |
| Grant date | Feb 4, 2020 |
| Priority date | — |
| Expiry date | Nov 15, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Disclosed herein is a technique to efficiently pack a print volume of 3D printers having print jobs with a large number of objects. The technique positions unique objects that adhere to a similar structural pattern more closely when the degree of variation between the objects is small. Thus, while each object is unique, a greater extent of similarity between the objects causes a given group of objects to be positioned more closely to one another in the print area of the 3D printer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.