Patent · US Active

Electronic substrates and interposers made from nanoporous films

US10553358B2 · kind B2 · utility

0Cited by

1References

24Claims

0Family size

Assignee

The Regents of the University of California · US

Inventors

Mark Bachman · Irvine, US
Guann-Pyng Li · Irvine, US

Key dates

Filing date	Apr 27, 2017
Grant date	Feb 4, 2020
Priority date	—
Expiry date	Apr 27, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH10D62/123
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An electronic substrate or interposer comprising nanoporous films, such as anodic aluminum oxide, containing vertically etched openings (“vias”) that are filled with a conductive material, forming a high density collection of vertically oriented vias that conduct electricity from one side of the substrate to the other.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.