Multilayer ceramic electronic component and interposer included therein
US10553362B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2018 |
| Grant date | Feb 4, 2020 |
| Priority date | — |
| Expiry date | Dec 7, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes, first and second external electrodes disposed on first and second external surfaces of the ceramic body, and an interposer including an insulating body and first and second terminal electrodes. (B1+B2)/2 is greater than or equal to 10 micrometers (μm) and less than C/2, and C is greater than (B1+B2) and less than or equal to 80 μm, in which B1 is a thickness of an upper portion, of each of the first and second terminal electrodes, disposed above the insulating body, B2 is a thickness of a lower portion, of each of the first and second terminal electrodes, disposed below the insulating body, and C is a thickness of the interposer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.