Impedance compensation of flip chip connection for RF communications
US10553551B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 8, 2018 |
| Grant date | Feb 4, 2020 |
| Priority date | — |
| Expiry date | May 8, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30111
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flip chip IC device utilized in RF transceivers includes a bare die having a number of metalized pads and each metalized pad has a solder ball deposited thereon. The flip chip IC device further includes a substrate having a number of connector pads corresponding to the metalized pads. The connector pads are connected to one or more electronic components disposed on the substrate via a number of connector strips. The bare die is flipped up-side-down such that the metalized solder pads are aligned and connected with the connector pads of the substrate via the solder balls. At least one of the connector strips includes a strip section having an uneven strip width configured to compensate an impedance of a transmission line formed based on a connection between a metalized pad of the bare die and a connector pad of the substrate to match predetermined impedance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.