Image sensor, stacked image sensor, image processing apparatus, and method of fabricating image sensor chip package
US10553635B2 · kind B2 · utility
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1References
20Claims
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Key dates
| Filing date | Sep 23, 2016 |
| Grant date | Feb 4, 2020 |
| Priority date | — |
| Expiry date | Feb 12, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C29/832
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An image sensor includes a pixel array and a peripheral circuit. The peripheral circuit is electrically connected to the pixel array and includes a logic block and at least one redundancy block to replace the logic block when the logic block is a defective block.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.