Encapsulation method and structure of organic light emitting diode
US10553820B2 · kind B2 · utility
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Key dates
| Filing date | Sep 21, 2015 |
| Grant date | Feb 4, 2020 |
| Priority date | — |
| Expiry date | Sep 21, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K2102/351
Abstract
An encapsulation method and encapsulation structure of an organic light emitting diode (OLED) are provided. The method includes: preparing an OLED substrate, the OLED substrate comprises a base substrate and at least one OLED device formed on the base substrate; forming a first encapsulation layer at a side of the OLED substrate formed with the OLED device to cover the OLED device; and forming a second encapsulation layer on the first encapsulation layer, the second encapsulation layer is a metal layer.
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