Patent · US Active

Microphone with encapsulated moving electrode

US10555090B2 · kind B2 · utility

0Cited by

0References

20Claims

0Family size

Assignees

Akustica, Inc. · US
Robert Bosch GmbH · DE

Inventors

Jochen Reinmuth · Reutlingen, DE
Vijaye Kumar Rajaraman · Villach, AT
Daniel Christoph Meisel · Pittsburgh, US
Bernhard Gehl · Wannweil, DE

Key dates

Filing date	Jun 5, 2018
Grant date	Feb 4, 2020
Priority date	—
Expiry date	Jun 5, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH04R2201/003
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A MEMS microphone system with encapsulated movable electrode is provided. The MEMS microphone system comprises a MEMS sensor having an access channel, a plug, and first and second members. The access channel configured to receive the plug is formed on at least one of the first and second member. A vacuum having a pressure different from a pressure outside the MEMS sensor is formed between the first and second members.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.