Mainboard assembly including a package overlying a die directly attached to the mainboard

US10555417B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Damion Searls · Hillsboro, US
• Weston Roth · Hillsboro, US
• Margaret D. Ramirez · Forest Grove, US
• James Jackson · Salmon Arm, CA
• Rainer Thomas · Beaverton, US
• Charles A. Gealer · Phoenix, US

Key dates

• Filing date: Feb 20, 2019
• Grant date: Feb 4, 2020
• Expiry date: Feb 20, 2039

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P70/50
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Disclosed are embodiments of a system-level assembly including an integrated circuit (IC) die directly attached to a mainboard. An IC die directly attached to a mainboard or other circuit board may be referred to as a direct-chip attach (DCA) die. A package is disposed over at least a portion of the DCA die and coupled with the mainboard. The package includes one or more other IC die disposed on a substrate. Other embodiments are described and claimed.