Thermal interface materials with reinforcement for abrasion resistance and/or suitable for use between sliding components
US10555439B2 · kind B2 · utility
1Cited by
2References
19Claims
0Family size
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Key dates
| Filing date | Sep 7, 2018 |
| Grant date | Feb 4, 2020 |
| Priority date | — |
| Expiry date | Sep 7, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/3672
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Exemplary embodiments are disclosed of thermal interface materials with reinforcement for abrasion resistance and/or suitable for use between sliding components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.