Patent · US Active

Splitting of thick hard-foam plates

US10556357B2 · kind B2 · utility

2Cited by
2References
15Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 3, 2015
Grant dateFeb 11, 2020
Priority date
Expiry dateMar 31, 2036

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB29L2007/008
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

The present invention relates to a method for cutting rigid foams, especially slabstock P(M)I foams. A method is provided here, by means of which it is possible to cut these rigid foams even in relatively high layer thicknesses of, for example, more than 3 mm, without material loss, which is produced in relevant amounts, for example, in the course of sawing as a result of the sawdust formed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.