Splitting of thick hard-foam plates
US10556357B2 · kind B2 · utility
2Cited by
2References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 3, 2015 |
| Grant date | Feb 11, 2020 |
| Priority date | — |
| Expiry date | Mar 31, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2007/008
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention relates to a method for cutting rigid foams, especially slabstock P(M)I foams. A method is provided here, by means of which it is possible to cut these rigid foams even in relatively high layer thicknesses of, for example, more than 3 mm, without material loss, which is produced in relevant amounts, for example, in the course of sawing as a result of the sawdust formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.