Wafer level integrated MEMS device enabled by silicon pillar and smart cap
US10556792B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 28, 2017 |
| Grant date | Feb 11, 2020 |
| Priority date | — |
| Expiry date | Nov 28, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/037
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
The present disclosure relates to a micro-electro mechanical system (MEMS) package and a method of achieving differential pressure adjustment in multiple MEMS cavities at a wafer-to-wafer bonding level. A device substrate comprising first and second MEMS devices is bonded to a capping substrate comprising first and second recessed regions. A ventilation trench is laterally spaced apart from the recessed regions and within the second cavity. A sealing structure is arranged within the ventilation trench and defines a vent in fluid communication with the second cavity. A cap is arranged within the vent to seal the second cavity at a second gas pressure that is different than a first gas pressure of the first cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.