Electron beam curable pressure sensitive adhesive comprising acrylic polymer with bound vinyl group
US10557064B2 · kind B2 · utility
0Cited by
6References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 10, 2015 |
| Grant date | Feb 11, 2020 |
| Priority date | — |
| Expiry date | Mar 21, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2433/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The invention relates to a process for making e-Beam curable pressure sensitive adhesive compositions by derivatizing an acrylic polymer having one or more hydroxy groups or one or more acid groups with a derivatizing agent prepared from a hydroxy-functional acrylate monomer and a diisocyanate. The pressure sensitive adhesive can be effectively cured without a photoinitiator or reactive diluent. Also disclosed are e-Beam curable pressure sensitive adhesives made with the derivatizing agent and methods for adhering substrates with the pressure sensitive adhesive compositions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.