Adhesive composition for photocurable interface and surface modification method of substrate using the same
US10557066B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | Oct 6, 2016 |
| Grant date | Feb 11, 2020 |
| Priority date | — |
| Expiry date | Oct 6, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G77/50
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention relates to an adhesive composition capable of improving adhesion force between two interfaces through thermal crosslinking and photo-crosslinking of a substrate and a resin, or a resin and a resin, in processes for optical devices and electronic devices, and a preparation method thereof. Specifically, the present invention relates to an adhesive composition capable of adhering an interface between a substrate and a photocurable resin, and a method of adhering an interface using the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.