Multilayer structure, method for producing the same and touch sensitive display using the same
US10558071B2 · kind B2 · utility
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2References
9Claims
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Key dates
| Filing date | Sep 7, 2010 |
| Grant date | Feb 11, 2020 |
| Priority date | — |
| Expiry date | Jul 10, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2813
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention is directed to an optical bonding apparatus with multiple layer structure including a pressure sensitive bonding layer and a thermal flow pressure sensitive bonding layer. The thermal flow pressure sensitive bonding layer is used for bonding to a rough surface of an object and superposing on the pressure sensitive bonding layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.