Method and structure for a 3D wire block
US10559476B2 · kind B2 · utility
0Cited by
2References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2017 |
| Grant date | Feb 11, 2020 |
| Priority date | — |
| Expiry date | Aug 28, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1131
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention provides for a structure and a mechanism by which by utilizing additive manufacturing processes electrical connections are created that connect the top and bottom of a block in a customizable pattern. Specifically connection points can be created on the surface of the block and route them to alternate locations transforming the original pattern to a smaller, larger, or alternate pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.