Method for manufacturing electronic device and electronic device
US10559478B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 26, 2016 |
| Grant date | Feb 11, 2020 |
| Priority date | — |
| Expiry date | Dec 26, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2023/4087
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Manufacturing method for an electronic device comprises a step of placing a substrate 10, which has a metal plate 11 on a back-surface side, on a back-surface-side mold 110 having a mold recessed part 111, a step of placing a front-surface-side mold 120 on the back-surface-side mold so as to cover the substrate 10; and a step of pouring resin between the front-surface mold 100 and the back-surface-side mold 110, when the substrate 10 is pressed against the back-surface-side mold 110. Circumferential part of the metal plate 11 is in contact with an edge of the mold recessed part 111 when the substrate 10 is pressed against the back-surface-side mold 110 in the step of pouring resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.