Trench capacitor with warpage reduction
US10559650B2 · kind B2 · utility
2Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 6, 2018 |
| Grant date | Feb 11, 2020 |
| Priority date | — |
| Expiry date | Jul 6, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/66
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A trench capacitor includes a plurality of trenches in a doped semiconductor surface layer of a substrate. At least one dielectric layer lines a surface of the plurality of trenches. A second polysilicon layer that is doped is on a first polysilicon layer that is on the dielectric layer which fills the plurality of trenches. The second polysilicon layer has a higher doping level as compared to the first polysilicon layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.