Power semiconductor module and power semiconductor device
US10561021B2 · kind B2 · utility
0Cited by
3References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 26, 2018 |
| Grant date | Feb 11, 2020 |
| Priority date | — |
| Expiry date | Feb 26, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/167
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The area projections or a spacer occupies on the upper surface of a resin casing increases as the size of a power semiconductor module decreases, and therefore another means for defining a clearance between a control board and the resin casing is desired. A power semiconductor module is provided, including: a housing which houses a power semiconductor chip; and at least one control pin or guide pin which protrudes outward from an upper surface of the housing, wherein the at least one control pin or guide pin has at least one step in a height direction from the upper surface of the housing toward a tip farthest from the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.