Ultrasound transducer and method for wafer level back face attachment
US10561398B2 · kind B2 · utility
1Cited by
1References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2016 |
| Grant date | Feb 18, 2020 |
| Priority date | — |
| Expiry date | Jan 5, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/708
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
Methods and systems are provided for a single element ultrasound transducer. In one embodiment, the ultrasound transducer comprises a front face, a back face parallel to the front face, a piezoelectric layer having a top surface electrically coupled to the signal pad and a bottom surface electrically coupled to the ground pad. In this way, the transducer can work robustly and may be automatically mounted to an imaging probe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.