Interconnection of conductor to feedthrough
US10561851B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Jun 29, 2017 |
| Grant date | Feb 18, 2020 |
| Priority date | — |
| Expiry date | Feb 3, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49149
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of interconnecting a conductor and a hermetic feedthrough of an implantable medical device includes welding a lead to a pad on a feedthrough. The feedthrough includes a ceramic insulator and a via hermetically bonded to the insulator. The via includes platinum. The pad is bonded to the insulator and electrically connected to the via, includes platinum, and has a thickness of at least 50 μm. The lead includes at least one of niobium, platinum, titanium, tantalum, palladium, gold, nickel, tungsten, and oxides and alloys thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.