Polyurethane CMP pads having a high modulus ratio
US10562149B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 23, 2016 |
| Grant date | Feb 18, 2020 |
| Priority date | — |
| Expiry date | Jan 31, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D18/0045
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical-mechanical polishing pad comprising a polyurethane polishing layer having a high storage modulus at low temperatures and a low storage modulus at high temperatures is disclosed. For example, the disclosed pad embodiments may be fabricated from a thermoplastic polyurethane having a ratio of storage modulus at 25 degrees C. to storage modulus at 80 degrees C. of 50 or more. The thermoplastic polyurethane polishing layer may further optionally have a Shore D hardness of 70 or more, a tensile elongation of 320 percent or less, a storage modulus at 25 degrees C. of 1200 MPa or more, and/or a storage modulus at 80 degrees C. of 15 MPa or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.