System for removing support structure from three-dimensional printed objects using microwave energy
US10562211B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 17, 2018 |
| Grant date | Feb 18, 2020 |
| Priority date | — |
| Expiry date | Jul 31, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B2214/04
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A system for manufacturing a three-dimensional object facilitates the removal of support material from the object. The system includes a controller configured to move a platen to position the object at a position opposite a microwave radiator and then operate the microwave radiator to change the phase of the support material from solid to liquid. The controller either monitors the expiration of a predetermined time period or a temperature of the object to determine when the microwave radiator operation is terminated. The microwave radiation does not damage the object because the support material has a dielectric loss factor that is greater than the dielectric loss factor of the object.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.