Heat-resistant glue roll structure with discharge through holes
US10562224B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 2, 2015 |
| Grant date | Feb 18, 2020 |
| Priority date | — |
| Expiry date | Jun 2, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB44C7/04
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention discloses a heat-resistant glue roll structure with discharge through holes, which comprises a shaft sleeved with a high-temperature resistance insulation layer on the surface thereof. Multiple discharge through holes are formed on the high-temperature resistance insulation layer and communicate the outer and inner surface of the high-temperature resistant insulation layer. A heat-resistant soft glue outer layer is also sleeved on the surface of the high-temperature resistant insulation layer. Since the high-temperature resistant insulation layer is provided with the discharge through holes in the present invention, air bubbles generated both between the high-temperature resistant insulation layer and the heat-resistant soft glue outer layer and between the high-temperature resistant insulation layer and the shaft would be squeezed to move towards the discharge through holes and discharged therefrom. No air bubbles would be accumulated in the heat-resistant glue roll structure of the present invention. Therefore, the internal structure thereof is stable in structural connection and the structure has long serving life, high stability and high safety and reliabi…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.