Interferometric imaging systems with exchangeable imaging modules
US10564373B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 19, 2018 |
| Grant date | Feb 18, 2020 |
| Priority date | — |
| Expiry date | Apr 8, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/809
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A modular assembly for an imaging system can allow precision alignment to occur in isolated manufacturing stages, with the separate components being assembled together in later stages. An exemplary system includes a support structure, multiple imaging modules exchangeably coupled to the support structure and each including lenslets and a photonic integrated circuit (PIC) device arranged to receive light from the lenslets, multiple fiber arrays each connected to corresponding one of the multiple imaging modules, and a camera system connected to the fiber arrays. The lenslets the PIC device can be integrally coupled prior to assembly with the support structure, so that precise alignment of the lenslets with respect to the PIC device is performed in isolation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.