Systems and methods for sensory automated material handing
US10564632B2 · kind B2 · utility
5Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2018 |
| Grant date | Feb 18, 2020 |
| Priority date | — |
| Expiry date | Feb 28, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/60
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In an embodiment an automated material handling system (AMHS) for a semiconductor fabrication facility (FAB) includes: a sensor supported by a rail, wherein the sensor is configured to collect sensor data characterizing a vehicle that moves along the rail, wherein the vehicle is configured to carry at least one wafer; and a monitoring module configured to: detect a trigger event based on the sensor data, and initiate a remediation action in response to the trigger event.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.