Touch sensor assembly and method of manufacturing same
US10564769B2 · kind B2 · utility
2Cited by
27References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 26, 2018 |
| Grant date | Feb 18, 2020 |
| Priority date | — |
| Expiry date | Nov 26, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03K2217/960785
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A touch sensor assembly may include a sensor mounting portion formed at a insulating substrate, and a soldering spot provided at the sensor mounting portion, wherein a touch sensor is stably fixed to the sensor mounting portion by the soldering spot. In addition, the touch sensor assembly according to an embodiment of the present disclosure includes a copper coating film coated on a insulating substrate, and a top layer printed on the copper coating film, wherein the copper coating film is protected by the top layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.