Circuit element package, manufacturing method thereof, and manufacturing apparatus thereof
US10566293B2 · kind B2 · utility
3Cited by
30References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 4, 2016 |
| Grant date | Feb 18, 2020 |
| Priority date | — |
| Expiry date | Mar 4, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1316
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A circuit element package, a manufacturing method thereof, and a manufacturing apparatus thereof are provided. The circuit element package includes a circuit element disposed on a printed circuit board, an insulating layer covering the circuit element, a first shielding layer covering a side surface of the insulating layer, and a second shielding layer covering an upper surface of the insulating layer and electrically connected to the first shielding layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.