Image sensing apparatus
US10566370B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2018 |
| Grant date | Feb 18, 2020 |
| Priority date | — |
| Expiry date | Jun 26, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/549
Abstract
An image sensing apparatus includes a first substrate structure, a second substrate structure, and a memory chip. The first substrate structure includes a pixel region having a photoelectric conversion element. The second substrate structure includes a first surface connected to the first substrate structure and a second surface opposite the first surface, and also includes a circuit region to drive the pixel region. The memory chip is mounted on the second surface of the second substrate structure. The first substrate structure and the second substrate structure are electrically connected by first connection vias passing through the first substrate structure. The second substrate structure and the memory chip are electrically connected by second connection vias passing through a portion of the second substrate structure. The first connection vias and the second connection vias are at different positions on a plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.