Patent · US Active

Optical device

US10566467B2 · kind B2 · utility

1Cited by
1References
8Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 15, 2016
Grant dateFeb 18, 2020
Priority date—
Expiry dateNov 15, 2036

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02E10/50
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate, thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.