Optical sensor and manufacturing method thereof
US10566476B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2017 |
| Grant date | Feb 18, 2020 |
| Priority date | — |
| Expiry date | Sep 22, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/30
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Some embodiments of the present disclosure provide an optical sensor. The optical sensor includes a semiconductive substrate; a light sensing region on the semiconductive substrate; a waveguide region configured to guide light from a wave insert portion through a waveguide portion and to a sample holding portion; and an interconnect region below the waveguide region, and the interconnect region being disposed above the light sensing region. The waveguide portion includes a first dielectric layer comprising a first refractive index and at least one second dielectric layer comprising a second refractive index, wherein the second refractive index is smaller than the first refractive index.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.