Molded surface mount device LED display module
US10566508B2 · kind B2 · utility
0Cited by
3References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 18, 2018 |
| Grant date | Feb 18, 2020 |
| Priority date | — |
| Expiry date | May 18, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A light emitting diode (LED) display module includes an array of surface-mount devices (SMDs) arranged in rows and columns on a substrate. Each SMD has red, green, and blue LED chips connected to the substrate and a first transparent resin portion molded around the LED chips; a black resin portion molded around each SMD in a manner to fill spaces between SMDs so as to block light emitted from a sidewall of each SMD; and a second transparent resin portion molded on the first transparent resin portion and the black resin portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.