High-density small form-factor pluggable module, housing, and system
US10566714B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 20, 2018 |
| Grant date | Feb 18, 2020 |
| Priority date | — |
| Expiry date | Mar 20, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04L69/14
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Embodiments described herein provide an apparatus for facilitating a double-density small form-factor pluggable (SFP-DD) module. The apparatus includes a set of control connector pins for exchanging control signals. The apparatus also includes a first set of communication connector pins for establishing a first communication channel and a second set of communication connector pins for establishing a second communication channel. The set of control connector pins and the first set of communication connector pins correspond to connector pins of an SFP module, and the second set of communication connector pins extends the SFP module. The size of the SFP-DD module corresponds to the size of the SFP module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.