Patent · US Active

Thermal interface structure for optical transceiver modules

US10567084B2 · kind B2 · utility

2Cited by

5References

19Claims

0Family size

Assignee

HONEYWELL INTERNATIONAL INC. · US

Inventors

Kai Zhang · Shanghai, CN
Ling Shen · Shanghai, CN
Liqiang Zhang · Shandong, CN
Ya Qun Liu · Shanghai, CN
Limei Cui · Shanghai, CN

Key dates

Filing date	Sep 18, 2018
Grant date	Feb 18, 2020
Priority date	—
Expiry date	Sep 18, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH05K7/2039
WIPO fieldTelecommunications
WIPO sectorElectrical engineering

Abstract

A thermal interface structure for electronic devices, such as telecommunications or data networking hardware, that utilize optical transceiver modules which are inserted within cage receptacles of the electronic devices. In order to provide for efficient heat transfer, the thermal interface structure is disposed between, and in abutment with, the optical transceiver module and a heat sink associated with the cage receptacle. The thermal interface structure includes a thermal interface layer including a phase change material, and a polymer layer connected to the thermal interface layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.