Manufacturing method for multi-layer printed circuit board
US10568212B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 26, 2015 |
| Grant date | Feb 18, 2020 |
| Priority date | — |
| Expiry date | Jan 12, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/107
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention enables the manufacture of a small-sized high-density multi-layer printed circuit board. The manufacturing method for a multi-layer printed circuit board, according to the present invention, comprises: a step in which an electrical insulation layer is formed by heating a laminate comprising a substrate, a heat-curable resin composition layer provided on the substrate, and a release substrate provided on the heat-curable resin composition layer, thereby curing the heat-curable resin composition layer, and a step in which a via hole is formed in the electrical insulation layer by irradiating a laser from above the release substrate. In addition, in the present invention, the release substrate has a thickness of at least 80 μm and is formed using a material having a glass transition temperature, the heat-curable resin composition layer has a volatile component-content of 7.0 mass % or less and a thickness of 25 μm or less, and the curing of the heat-curable resin composition layer occurs at a temperature that is not less than the glass transition temperature of the material of the release substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.