Patent · US Active

Method for producing multi-level metalization on a ceramic substrate

US10568214B2 · kind B2 · utility

0Cited by

11References

11Claims

0Family size

Assignee

CERAMTEC GMBH · DE

Inventors

Sigurd Adler · Marbach am Neckar, DE
Roland DILSCH · Thierstein, DE
Alfred Thimm · Wunsiedel, DE

Key dates

Filing date	Jun 20, 2017
Grant date	Feb 18, 2020
Priority date	—
Expiry date	Jun 20, 2037

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/24355
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A method for producing a copper multi-level metallization on a ceramic substrate consisting of AlN or Al2O3. High power regions with metallization having a high current-carrying capacity and low power regions with metallic coatings having a low current-carrying capacity are created on one and the same ceramic substrate. The metallization is printed multiple times in the high power range.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.