On-board charger with heat dissipation structure
US10568235B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2018 |
| Grant date | Feb 18, 2020 |
| Priority date | — |
| Expiry date | Dec 28, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02T90/14
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention discloses an on-board charger with a heat dissipation structure. The on-board charger comprises a casing, and heat generating components, a PCB and a heat dissipation structure which are arranged inside the casing, and is characterized in that the heat dissipation structure is a coolant flow channel; the coolant flow channel is arranged longitudinally with respect to the heat generating components, and is in full contact with each heat generating component; heat is dissipated from the heat generating components by using respective surfaces of the coolant flow channel. The on-board charger with the heat dissipation structure provided by the present invention has the advantages of small size, excellent heat dissipation effect, simple assembly, low cost and light weight.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.