Space-efficient pressure relief mechanism for immersion cooling of computing elements
US10568236B2 · kind B2 · utility
8Cited by
1References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 27, 2017 |
| Grant date | Feb 18, 2020 |
| Priority date | — |
| Expiry date | Apr 26, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A cooling apparatus includes a chamber and a pressure-relief element. The chamber includes a coolant in a liquid phase disposed near a heat-generation object. The coolant in the liquid phase dissipates heat from the heat-generation object and is converted from the liquid phase to a vapor phase upon the coolant in the liquid phase reaching a boiling temperature. The pressure-relief element has a conduit. A first end of the conduit is submerged in the coolant in the liquid phase internal to the chamber and a second end of the conduit is connected to atmosphere external to the chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.