Method and apparatus for release-assisted microcontact printing of MEMS
US10570005B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 5, 2012 |
| Grant date | Feb 25, 2020 |
| Priority date | — |
| Expiry date | Sep 5, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/0194
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
The disclosure provides methods and apparatus for release-assisted microcontact printing of MEMS. Specifically, the principles disclosed herein enable patterning diaphragms and conductive membranes on a substrate having articulations of desired shapes and sizes. Such diaphragms deflect under applied pressure or force (e.g., electrostatic, electromagnetic, acoustic, pneumatic, mechanical, etc.) generating a responsive signal. Alternatively, the diaphragm can be made to deflect in response to an external bias to measure the external bias/phenomenon. The disclosed principles enable transferring diaphragms and/or thin membranes without rupturing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.