Patent · US Active

Fabrication of multilayered carbon MEMS devices

US10570010B1 · kind B1 · utility

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15Claims
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Key dates

Filing dateJun 16, 2017
Grant dateFeb 25, 2020
Priority date
Expiry dateNov 14, 2037

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB81C2201/0198
  • WIPO fieldMicro-structural and nano-technology
  • WIPO sectorChemistry

Abstract

The various technologies presented herein relate to formation of carbon micromechanical systems (CMEMS), wherein the CMEMS comprise multiple layers of carbon structures and are formed using a plurality of photoresist precursors that are processed to form carbon. The various embodiments can be utilized in producing a plurality of CMEMS with full production level fabrication, e.g., 6 inch wafers can be processed. A pyrolyzed layer of carbon is lithographically defined after pyrolysis, wherein the post-pyrolysis etch process can produce carbon structures having repeatable and accurate device geometries, with straight sidewalls. A sacrificial layer can be applied to facilitate separation of a first carbon layer from a second carbon layer, wherein, upon pyrolysis to form the second carbon layer and lithography thereof, the sacrificial layer is removed to form a CMEMS comprising a first carbon layer (e.g., comprising bottom contacts) located beneath a second carbon layer (e.g., a mechanical layer).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.