Fabrication of multilayered carbon MEMS devices
US10570010B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 16, 2017 |
| Grant date | Feb 25, 2020 |
| Priority date | — |
| Expiry date | Nov 14, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/0198
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
The various technologies presented herein relate to formation of carbon micromechanical systems (CMEMS), wherein the CMEMS comprise multiple layers of carbon structures and are formed using a plurality of photoresist precursors that are processed to form carbon. The various embodiments can be utilized in producing a plurality of CMEMS with full production level fabrication, e.g., 6 inch wafers can be processed. A pyrolyzed layer of carbon is lithographically defined after pyrolysis, wherein the post-pyrolysis etch process can produce carbon structures having repeatable and accurate device geometries, with straight sidewalls. A sacrificial layer can be applied to facilitate separation of a first carbon layer from a second carbon layer, wherein, upon pyrolysis to form the second carbon layer and lithography thereof, the sacrificial layer is removed to form a CMEMS comprising a first carbon layer (e.g., comprising bottom contacts) located beneath a second carbon layer (e.g., a mechanical layer).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.