Patent · US Active

High entropy alloy having composite microstructure

US10570491B2 · kind B2 · utility

24Cited by

0References

4Claims

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Assignee

The Industry & Academic Cooperation in Chungnam National University (IAC) · KR

Inventors

Sun Ig Hong · Daejeon, KR
Jae Sook Song · Daejeon, KR

Key dates

Filing date	Mar 10, 2017
Grant date	Feb 25, 2020
Priority date	—
Expiry date	Jan 27, 2038

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/12931
WIPO fieldMaterials, metallurgy
WIPO sectorChemistry

Abstract

A metallic alloy, more particularly, a high-entropy alloy with a composite structure exhibits high strength and good ductility, and is used as a component material in electromagnetic, chemical, shipbuilding, machinery, and other applications, and in extreme environments, and the like.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.