Package waveguide for acoustic sensor with electronic delay compensation
US10573289B2 · kind B2 · utility
1Cited by
4References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 1, 2017 |
| Grant date | Feb 25, 2020 |
| Priority date | — |
| Expiry date | Apr 25, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2217/03
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system and method use an array of ultrasonic transducers to emit and receive sound in a phased array fashion by using acoustic waveguides to achieve a desired acoustic radiation and reception pattern. A chip package attached to an acoustic transducer array includes acoustic waveguides coupled to acoustic ports. Each waveguide is coupled between a corresponding acoustic transducer and a corresponding acoustic port. A spacing of a pair of acoustic ports is different than a spacing of a corresponding pair of acoustic transducers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.