High density memory module system
US10573354B2 · kind B2 · utility
1Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2016 |
| Grant date | Feb 25, 2020 |
| Priority date | — |
| Expiry date | Jan 28, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F3/0685
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Approaches, techniques, and mechanisms are disclosed for manufacturing and operating high density memory systems. The high density memory systems can increase the amount of memory available to a computing system by allowing the connection of multiple memory modules into a single memory interface on a motherboard via a memory adapter as described herein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.