Patent · US Active

Electronic component

US10573478B2 · kind B2 · utility

0Cited by
2References
12Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 11, 2016
Grant dateFeb 25, 2020
Priority date
Expiry dateJun 14, 2036

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB81B7/007
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

The present disclosure relates to an electronic high-frequency component for accommodating micro-devices, having at least two housing parts which are joined together by a metal frame and which enclose a cavity, and at least one input signal line configured to introduce electrical high-frequency signals from outside of the component into the cavity. The input signal line is connected to a signal line via. Furthermore, the high-frequency component also has at least one short-circuit via which electrically connects the metal frame to at least one of the housing parts of the component.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.