Electronic component
US10573478B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 11, 2016 |
| Grant date | Feb 25, 2020 |
| Priority date | — |
| Expiry date | Jun 14, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B7/007
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to an electronic high-frequency component for accommodating micro-devices, having at least two housing parts which are joined together by a metal frame and which enclose a cavity, and at least one input signal line configured to introduce electrical high-frequency signals from outside of the component into the cavity. The input signal line is connected to a signal line via. Furthermore, the high-frequency component also has at least one short-circuit via which electrically connects the metal frame to at least one of the housing parts of the component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.