Devices for cooling and power
US10573574B2 · kind B2 · utility
0Cited by
17References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2014 |
| Grant date | Feb 25, 2020 |
| Priority date | — |
| Expiry date | Nov 15, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12032
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Certain embodiments disclosed herein are directed to devices for cooling. In certain examples, a thermoelectric device comprising a substrate and a superlattice coupled to the substrate is disclosed. In some examples, the superlattice includes a first semi-conducting material and a second semi-conducting material coupled to the first semi-conducting material to provide an interface between the first and second semi-conducting materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.