Additive manufactured RF module
US10573949B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 20, 2017 |
| Grant date | Feb 25, 2020 |
| Priority date | — |
| Expiry date | Mar 9, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/2039
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A spacecraft includes a feed array that includes a plurality of unitary modules, each module including a respective plurality of radio frequency (RF) waveguides structurally coupled together with at least one connecting feature. For each unitary module, the at least one connecting feature and a wall structure defining the respective plurality of waveguides are co-fabricated using an additive manufacturing process. The plurality of unitary modules includes a first unitary module including a first plurality of waveguides and a second unitary module including a second plurality of waveguides. The first unitary module and the second unitary module are configured to be integrated together so as to electrically couple at least one of the first plurality of waveguides with at least one of the second plurality of waveguides.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.