Adhesive with tailorable electrical conductivity for monitoring mechanical properties of adhesive joint within polymeric composites
US10573976B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 6, 2018 |
| Grant date | Feb 25, 2020 |
| Priority date | — |
| Expiry date | Jul 5, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/041
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A functionalized adhesive and systems and methods employing the same are disclosed. The functionalized adhesive is configured to form an adhesive joint between a first substrate and a second substrate. The functionalized adhesive comprises a neat adhesive selected to have a bonding strength above a predetermined bonding threshold and a filler selectively dispersed within the neat adhesive. The filler is selected to modify electrical properties of the neat adhesive such that the functionalized adhesive is electrically conductive with a tailored resistivity and such that a resistance of the adhesive joint is greater than a resistance of the first substrate and the second substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.