Lens module comprising an image sensor mounted in the receiving groove of a circuit board with electronic components and method for assembling the same
US10574870B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 20, 2018 |
| Grant date | Feb 25, 2020 |
| Priority date | — |
| Expiry date | Sep 10, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B7/026
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A lens module with compact appearance includes a circuit board, an image sensor, a package bracket, an optical filter, and a lens unit. The circuit board defines a first receiving groove for receiving the image sensor. The circuit board has electronic components and gold fingers on one surface. Metallic wires are arranged on edges of a surface of the image sensor. The package bracket is integrally formed on the circuit board to wrap the electronic components, the gold fingers, and the metallic wires therein. The optical filter is connected to surface of the package bracket facing away from the circuit board. The lens unit includes a hollow lens holder and a lens mounted in the lens holder. The lens holder is connected to the surface of the mounting frame facing away from the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.